04/13/2020
wuhan, china, april 13, 2020 - yangtze memory technologies co., ltd (ymtc), today announced that its 128-layer 1.33tb qlc 3d nand flash memory chip, x2-6070, has passed sample verification on the ssd platform through co-working with multiple controller partners. as the first qlc based 128-layer 3d nand, x2-6070 has achieved the highest bit density, highest i/o speed and highest capacity so far among all released flash memory parts in the industry①. accompanying this release, ymtc introduced a 128-layer 512gb tlc (3 bit/cell) chip, x2-9060, to meet diversified application requirements. ...
03/24/2020
unisoc 8910dm is the world’s first iot wide area chip platform that is compliant with cat.1bis. the advanced platform is packed with comprehensive advantages...
03/24/2020
ivy v5663 can be used extensively in diversified scenarios, such as smart home, healthcare, childhood education, aesthetic health care, warehousing and...
03/24/2020
unisoc’s aip solution integrates antenna array and rf front-end ic, to support multiple mmwave bands including n257, n258 and n261. compared to the existing...
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